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wafer back grinding services malaysia

Wafer grinding, ultra thin,TAIKOdicing-grinding service. TAIKO is a DISCO developedwafer back grindingmethod. By enabling an outer support ring to thewafer(the TAIKO ring, Japanese for drum),back grindingis performed on the inner circular area of the wafer, while leaving an edge of a few millimeters unprocessed. Taiko simplifies thin wafer

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